Component stacking in multi-chip semiconductor packages

A multi-chip package comprising

• a substrate,
• a multiplicity of components including,
• a film based component formed on the substrate,
• a discrete component mounted on the substrate and stacked over the film based component such that the film based component is electrically insulated from the stacked discrete component and the discrete component and the film based component do not interfere with each others function, the discrete components not being formed from a film applied to the substrate, and
• a die component mounted on the substrate;
• a plurality of leads for electrically connecting the multi-chip package to external circuitry, the leads being electrically coupled to associated ones of said multiplicity of components;
• a plurality of wiring traces formed on the substrate, the wiring traces being arranged to electrically connect various ones of said multiplicity of components;
• a packaging material that encapsulates said multiplicity of components and the wiring traces and leaves a portion of the leads exposed to facilitate electrically connecting the multi-chip package to external circuitry;
• and
• wherein a gap electrically isolates the film based component from the discrete component.

A multi-chip package comprising:

• a substrate;
• a multiplicity of components including a plurality of film based components, a plurality of discrete components and a plurality of die components,
• the plurality of film based components being formed on the substrate, the film based components being selected from a group consisting of capacitors, resistors, and inductors;
• a passivazation layer formed over selected ones of said film based components that are intended for stacking;
• the plurality of discrete components being mounted on the substrate, wherein selected ones of the discrete components that are intended for stacking are stacked over associated ones of the film based components such that the passivazation layer electrically and functionally isolates the associated film based components from the selected ones of the discrete components, the discrete components being selected from a group consisting of capacitors, resistors, inductors and crystals;
• the plurality of die components being mounted on the substrate;
• a plurality of leads for electrically connecting the multi-chip package to external circuitry, the leads being electrically coupled to associated ones of said multiplicity of components;
• a plurality of wiring traces formed on the substrate, the wiring traces being arranged to electrically connect various associated ones of said multiplicity of components;
• and
• a packaging material that encapsulates said multiplicity of components and the wiring traces and leaves a portion of the leads exposed to facilitate electrically connecting the multi-chip package.