Semiconductor sensor having a protective layer
AssigneeRobert Bosch GmbH
InventorsUwe Lipphardt, Guenther Findler, Horst Muenzel, Helmut Baumann
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Abstract
A semiconductor chip, which is preferably designed as a pressure sensor, has on its rear side one or more depressions in which the pressure is measured by correspondingly designed diaphragms which are coupled to piezosensitive circuits. The surface of the depressions and, optionally, the rear side of the semiconductor chip are coated with a protective layer which ensures that the semiconductor is protected from aggressive media. The protective layer thereby makes it possible to use the sensor universally in acids, lyes or hot gases.
Claims10
A semiconductor chip comprising:
- a rear side with at least one depression;
- an upper wall including an elastically deformable diaphragm;
- a piezosensitive circuit arrangement, fixed to the diaphragm, for detecting a displacement of the diaphragm;
- and
- a silicon carbide protective layer covering the at least one depression and the rear side of the semiconductor chip, wherein rear side of the semiconductor chip is bonded to a substrate via the silicon carbide protective layer.
A pressure sensor comprising:
- a semiconductor chip including
- a rear side with at least one depression,
- an upper wall including an elastically deformable diaphragm,
- a piezosensitive circuit arrangemente, fixed to the diaphragm, for detecting the displacement of the diaphragm, and
- a silicon carbide protective layer covering the at least one depression and the rear side of the semiconductor chip;
- a substrate;
- a protective sleeve;
- and
- at least one electrical contact, wherein the semiconductor chip is fixed to the substrate via the silicon carbide protective layer, the protective sleeve covers the semiconductor chip, and the at least one electrical contact is coupled to the piezosensitive circuit arrangement and provides external contact to the pressure sensor.
Dependencies are inferred from the claim text.