Manufacture of semiconductor connection components with frangible lead sections
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, John W. Smith, Konstantine Karavakis, Joseph Fjelstad
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Abstract
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.
Claims23
A method of making a semiconductor connection component comprising the steps of forming a plurality of elongated leads extending over a gap in a support structure, each said lead including lead-forming material in an elongated, strip-like lead region extending in a lead direction and having longitudinal edge boundaries extending in the lead direction, and forming frangible sections in said leads by applying a weakening treatment to lead-forming material throughout an elongated treatment zone extending across a plurality of said lead regions transverse to said lead directions, whereby said weakening treatment is applied across the longitudinal edge boundaries of said leads.
Dependencies are inferred from the claim text.