Polishing pad for chemical-mechanical polishing of a semiconductor substrate
AssigneeMotorola, Inc.
InventorsTat-Kwan Yu, Chris C. Yu
Life of this patent
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Abstract
A mold is used to form a polishing pad, wherein the surface of the polishing side of the polishing pad is determined by a primary surface of the mold. Features along the polishing side of a polishing pad may take any one of several different shapes. Channels along the polishing side of the polishing pad allow a smaller pore size to be used. The mold allows more control over the surface of the polishing side, which in turn give more control over polishing characteristics.
Claims20
A polishing pad for chemical-mechanical polishing of a semiconductor substrate, wherein:
- the polishing pad has a polishing side for polishing the semiconductor substrate;
- the polishing side has a plurality of features that each have a height;
- and
- a standard deviation of the heights is less than 20 microns.
A polishing pad for chemical-mechanical polishing of a semiconductor substrate comprising a plurality of pores, wherein an average pore size is smaller than 10 microns.
A polishing pad for chemical-mechanical polishing of a semiconductor substrate comprising:
- a first channel;
- and
- a second channel, wherein the second channel intersects the first channel at an acute angle that is no greater than 70 degrees.
Dependencies are inferred from the claim text.