Method for producing input/output connections in a ceramic device

A method of making input/output connector pads for a ceramic device, comprising the steps of:

• providing a first ceramic layer in a green state and having a predetermined thickness defined by an upper and a lower surface and a second ceramic layer in a green state and having a predetermined height defined by a top and bottom surface;
• forming at least one first via through the first ceramic layer and at least one second via through the second ceramic layer, the at least one second via being offset from and connecting to the first via;
• substantially filling the first and the at least one second via with metalization;
• laminating the lower surface of the first ceramic layer to the top surface of the second ceramic layer to form a laminate;
• scoring the laminate along at least one line, the line extending downwardly through the first via of the first ceramic layer and into a portion of the second ceramic layer such that the line does not intersect the at least one second via;
• cofiring the ceramic layers and the metalization;
• and
• cleaving the laminate along the line, whereby a fracture propagates through the second ceramic layer separating the laminate such that the fracture does not propagate into the at least one second via.