Dicing machine with non-contact setup function

A dicing machine comprising:

• a machining table having a surface for supporting a semiconductor wafer;
• a cutting blade for cutting the semiconductor wafer supported by the machining table;
• a gap detection device for detecting a preselected gap between the cutting blade and the surface of the machining table;
• a position control device for moving the cutting blade and the gap detection device in a vertical direction and for recognizing the positions thereof;
• a non-contact detection device for detecting non-contact between the gap detection device and a cutting edge of the cutting blade, the non-contact detection device being placed at a standard position for determining the cutting blade position at a cutting position of the semiconductor wafer;
• and
• an arithmetic operation device for calculating the cutting position of the semiconductor wafer in accordance with a position recognized by the position control device when a predetermined gap between the cutting blade and the upper surface of the machining table is detected by the gap detection device, and in accordance with positions recognized by the position control device when the gap detection device and the cutting edge of the cutting blade are detected by the non-contact detection device.

A dicing machine comprising:

• a work table having a surface for supporting a workpiece;
• a machining tool for machining he workpiece;
• a gap detection device for detecting a preselected gap between the machining tool and the surface of the work table;
• a non-contact detection device for detecting a non-contact condition between the gap detection device and a machining portion of the machining tool;
• and
• a calculating device for calculating a machining position of the workpiece when the preselected gap between the machining tool and the surface of the work table is detected by the gap detection device and when the non-contact condition of the gap detection device and the machining portion of the machining tool is detected by the non-contact detection device.