Process for bonding a contact layer of silver-metal oxide material and metal contact base, and suitable contact layer

Abstract

A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such a way that the metal oxide is at least partially reduced to metal at least on the solder side at the surface and in the subsurface region of the contact facing. The reduction can be carried out by heat treatment in reducing atmosphere. In the case of contact materials based on silver/iron oxide (AgFe.sub.2 O.sub.3 /Fe.sub.3 O.sub.4), in particular, the iron oxide may also be reduced to iron on the switching side since iron oxide is again formed after switching. Alternatively, contact facings may be provided with carbon as reducing agent on the solder side. In particular, the reduction may take place locally in this case.

Dependencies are inferred from the claim text.