Inspecting method of an electronic component during a mounting operation of the same onto a substrate

A method for inspecting an electronic component having a plurality of lead rows, each lead row including plural leads arrayed in a line along and protruding from a side face of a main body thereof, said method comprising steps of:

• measuring positional data of said plural leads, said positional data including altitudinal values representing heights of respective leads;
• obtaining approximate lines on the basis of said positional data, each approximate line approximating each lead row of said plural leads on a side face of the main body of said electric component;
• detecting a faulty lead on the basis of said positional data, said faulty lead being extraordinarily deformed compared with other leads constituting a same lead row;
• and
• obtaining a mutual positional relationship between said approximate lines, and judging whether said mutual positional relationship is within a predetermined range.

A method for mounting an electronic component onto a substrate, said electronic component having a plurality of lead rows, each lead row including plural leads arrayed in a line along and protruding from a side face of a main body of said electronic component, said method comprising steps of:

• measuring positional data of said plural leads, said positional data including altitudinal values representing heights of respective leads;
• obtaining a plurality of approximate lines on the basis of said positional data, each approximate line approximating each lead row of said plural leads on a side face of the main body of said electric component;
• obtaining a mutual positional relationship between said approximate lines, and judging whether said mutual positional relationship is within a predetermined range;
• positioning the leads of the electronic component onto electrodes of said substrate only when said mutual positional relationship is within said predetermined range, said electrodes being applied solder beforehand;
• and
• heating said substrate mounting said electronic component and melting said solder to provide a rigid connection between said leads and said electrodes.

A method for mounting an electronic component onto a substrate, said electronic component having a plurality of lead rows, each lead row including plural leads arrayed in a line along and protruding from a side face of a main body of said electronic component, said method comprising steps of:

• measuring positional data of said plural leads, said positional data including altitudinal values representing heights of respective leads;
• obtaining a plurality of approximate lines on the basis of said positional data, each approximate line approximating each lead row of said plural leads on a side face of the main body of said electric component;
• detecting a faulty lead on the basis of said positional data, said faulty lead being extraordinarily deformed compared with other leads constituting a same lead row;
• obtaining a mutual positional relationship between said approximate lines, and judging whether said mutual positional relationship is within a predetermined range;
• positioning the leads of the electronic component onto electrodes of said substrate only when said faulty lead is not detected and said mutual positional relationship is within said predetermined range, said electrodes being applied solder beforehand;
• and
• heating said substrate mounting said electronic component and melting said solder to provide a rigid connection between said leads and said electrodes.