US 5,627,403 A · Adhesion between dielectric layers in an integrated circuit

Abstract

A method for improved adhesion between dielectric material layers at their interface during the manufacture of a semiconductor device, comprising operations for forming a first layer (1) of a dielectric material, specifically silicon oxynitride or silicon nitride, on a circuit structure (7) defined on a substrate of a semiconductor material (6) and subsequently forming a second layer (3) of dielectric material (silicon oxynitride or silicon nitride particularly) overlying the first layer (1). Between the first dielectric material layer and the second, a thin oxide layer (2), silicon dioxide in the preferred embodiment, is formed in contact therewith. This interposed oxide (2) serves an adhesion layer function between two superimposed layers (1,3).

Claims12

Dependent claims

An integrated circuit, comprising:

a substrate of a semiconductor material;
a first patterned conductor layer formed over said substrate;
a dielectric;
and
a second upper patterned conductor layer;
wherein said dielectric comprises:
a first layer of a first silicon nitride compound;
a thin silicon dioxide layer in contact with said first layer of said first silicon nitride compound at least in a region;
and
a second layer of a second silicon nitride compound overlaying said first layer of said first silicon nitride compound at least in said region and in contact with said thin silicon dioxide layer at least in said region;
the thickness of said thin silicon dioxide being less than both the thicknesses of said first and second layers of said first and second silicon nitride compounds
wherein the thickness of said thin silicon dioxide layer is in the range between 5 and 50 nm.

9 more elements

Dependencies are inferred from the claim text.

Adhesion between dielectric layers in an integrated circuit

Life of this patent

Adhesion between dielectric layers in an integrated circuit

Life of this patent

Abstract

Claims12