Binder for use in metal powder injection molding and debinding method by the use of the same
AssigneeKabushiki Kaisha Komatsu Seisakusho
InventorsTakemori Takayama, Masato Miyake, Yoshitaka Ohyama, Katsuyoshi Saito, Hiroshi Ono
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Abstract
By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.
Claims36
A binder for use in metal powder injection molding comprising:
- (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material;
- and
- (b) 25 to 60 wt % of a polyamide resin component containing (i) a polyamide resin material having 8 carbon atoms or more on average between amido groups and (ii) an aromatic bisamide serving as a compatibilizer and having 8 carbon atoms or more on average between amido groups, the amount of the aromatic bisamide mixed with the polyamide resin material being up to an amount substantially equal to the amount of the polyamide resin material.
A binder for use in metal powder injection molding comprising:
- (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material;
- and
- (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups.
A binder for use in metal powder injection molding comprising:
- (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material;
- and
- (b) 25 to 60 wt % of a polyamide resin component containing a polyamide resin material having 10 carbon atoms or more on average between amido groups, the polyamide resin material is prepared by co-polycondensation of (1) a C.sub.36 -dimeric acid having a linear chain system, C.sub.44 -dimeric acid or a mixture of a C.sub.36 -dimeric acid and a C.sub.44 -dimeric acid;
- (2) an aliphatic dicarboxylic acid having 6 to 10 carbon atoms;
- (3) xylylenediamine;
- and (4) ethylenediamine and/or hexamethylenediamine.
A binder for use in metal powder injection molding comprising:
- (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material;
- (b) 25 to 60 wt % of a polyamide resin component containing (i) a polyamide resin material having 10 carbon atoms or more on average between amido groups;
- and
- (c) up to 15 wt % of a lubricant.
Dependencies are inferred from the claim text.