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US 5,627,236 AGranted
Bonding resin and methods relating thereto
AssigneeE. I. Du Pont de Nemours and Company
InventorsEdward J. Deyrup, Diane M. Hahm, Herbert V. Bendler
Life of this patent
Estimating the term…
Abstract
The present invention relates generally to multi-phase compositions comprising: 1. an aromatic/aliphatic copolyester substantially continuous phase; and 2. a low modulus polymeric substantially discontinuous phase. More specifically, these innovative multi-phase compositions have generally been found to provide high temperature viscosity stability and excellent long-term, heat seal and barrier properties.
Claims4
A multi-phase heat sealing composition comprising:
- a) 55-98 weight percent (based upon 100 weight percent of the multi-phase composition) of a copolyester continuous phase having a glass transition temperature ("Tg") in the range of about 35.degree.-70.degree. C., the copolyester being derived from:
- 1. 50-95 mole percent (based upon 100 mole percent diacid) of an aromatic diacid from the group consisting of:
- terephthalic acid, isophthalic acid, naphthalaic dicarboxylic acid and mixtures thereof (hereafter, "Monomer A");
- 2. 2-40 mole percent (based upon 100 mole percent diacid) of a saturated aliphatic dicarboxylic acid from the group consisting of dicarboxylic acids containing from 5 to 12 carbon atoms and mixtures thereof (hereafter, Monomer B);
- 3. 60 to about 94 mole percent (based upon 100 mole percent diol) of a ethylene glycol and the balance being diethylene glycol (hereafter, Monomer C);
- wherein the copolyester is derived only from Monomer A, Monomer B, Monomer C and 0-2 moles of a branching agent per 100 moles diacid,
- b) 2-45 weight percent (based upon the weight of the multi-phase composition) of a substantially discontinuous phase comprising a low modulus ethylene copolymer.
4 more elements
Dependencies are inferred from the claim text.