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US 5,626,971 AGranted
Thin film probe
OwnerShei-Kung Shi, Fu-Hsiang Iseng +1inventors
InventorsShei-Kung Shi, Fu-Hsiang Iseng, Chong-Kai Kuo
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Abstract
The present invention relates to a multichip module comprising one or more thin film probes. The thin film probes are useful in in situ probe testing of IC chips. An assembly comprising the multichip module and a circuit board having IC chips in a number corresponding to the number of thin film probes is also claimed.
Claims6
A thin film probe device comprising:
- a substrate which comprises a non-conducting material;
- a stacked structure of patterned multiple metal layers and multiple intermetal dielectric layers deposited on the substrate;
- a Cr film deposited on part of said stacked structure;
- a Cu film deposited on the Cr film;
- a patterned soft conducting solder material deposited on the Cu film to position the thin film probe;
- several round tip heads comprising hard conducting material formed on top of said soft conducting solder material;
- a passivation layer covering the whole surface of the device, exposing only the thin film probe.
4 more elements
Dependencies are inferred from the claim text.