Transfer molding machine for encapsulation of semiconductor devices
AssigneeDai-Ichi Seiko Co., Ltd.
InventorMasaaki Ishii
Life of this patent
Estimating the term…
Abstract
A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.
Claims8
A transfer molding machine for encapsulation of semiconductor devices with a resin, comprising:
- a clamping mechanism including a stationary base platen provided with tie rods, a moving platen movably mounted on said tie rods, a stationary upper platen fixed to said tie rods, and an electrically actuated toggle mechanism are ranged between said base platen and said moving platen to force the moving platen to move;
- a transfer mold including a pair of upper and lower mold sections respectively mounted on said upper stationary platen and said moving platen;
- and
- at least one compensation unit arranged either between said upper stationary platen and said upper mold section or between said moving platen and said lower mold section, each said compensation unit including upper and lower plates, a holding plate arranged between said upper and lower plates and provided with a plurality of through-holes, and a plurality of elastic members each being held in said through-holes of said holding plate, said elastic members having a length slightly greater than the thickness of said holding plate so as to provide a gap between said holding plate and one of said upper and lower plate.
Dependencies are inferred from the claim text.