Structure and method including dry etching techniques for forming an array of thermal sensitive elements

A method for forming an array of thermal sensitive elements from a substrate having portions of an infrared absorber and common electrode assembly attached thereto, comprising the steps of:

• forming a first layer of electrically conductive contacts on one side of said substrate to at least partially define masked and unmasked regions thereof;
• forming a second layer of electrically conductive contacts on said first layer of contacts;
• encapsulating the exposed portions of said second layer of contacts with a radiation etch mask layer;
• encapsulating the exposed portions of said first layer of contacts and said radiation etch mask layer with a dry-etch mask layer;
• dry etching through an initial portion of each of said unmasked regions;
• exposing a remaining portion of each of said unmasked regions to an etchant;
• irradiating said remaining portions of said unmasked region with electromagnetic energy to substantially increase the reactivity between said remaining portions and said etchant;
• and
• wherein during said step of irradiating, said etchant etches said remaining portions substantially faster than said first layer of contacts and said radiation etch mask layer.