Electroplating process
AssigneeShipley Company, L.L.C.
InventorsSteven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
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Abstract
A process for electroplating a metal clad substrate by forming a sacrificial coating over the metal cladding and then coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is contacted with an etchant for the sacrificial coating to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
Claims26
A process for depositing metal on the walls of openings passing through a copper clad non-metallic planar substrate, said process comprising the steps of forming a sacrificial coating over said copper cladding, without removing the sacrificial coating, providing a dispersion of carbonaceous particles in an aqueous medium and contacting said substrate having said openings with said dispersion to form a porous coating of said carbonaceous dispersion over the surfaces of said substrate including said sacrificial coating over the copper cladding, removing said carbonaceous coating from the copper cladding by contacting the substrate with an etchant that dissolves said sacrificial coating preferentially to the copper cladding, and plating metal on at least those portions of said substrate coated with said carbonaceous coating from an electrolytic metal plating solution.
A process for depositing metal on the walls of openings passing through a copper clad non-metallic printed circuit board planar substrate, said process comprising the steps of forming an oxide coating over said copper cladding, in the absence of a step of removing said oxide coating, providing a dispersion of carbonaceous particles in an aqueous medium and contacting said substrate having said openings with said dispersion to form a porous coating of said carbonaceous dispersion over the surfaces of said substrate including said oxide coating over the copper cladding, removing said carbonaceous coating from the copper cladding by contacting the substrate with an acid etchant that dissolves said oxide coating without substantially dissolving the copper cladding, and plating metal on at least those portions of said substrate coated with said carbonaceous coating from an electrolytic metal plating solution.
A process for depositing metal on the walls of openings passing through a copper clad non-metallic printed circuit board planar substrate, said process comprising the steps of forming an oxide coating over said copper cladding by contact of the substrate with a chlorite solution, providing a dispersion of carbonaceous particles in an aqueous medium, contacting said substrate having said openings with said dispersion to form a porous coating of said carbonaceous dispersion over the surfaces of said substrate including said oxide coating over the copper cladding, removing said carbonaceous coating from the copper cladding by contacting the substrate with an acid etchant that dissolves said oxide coating, and plating metal on at least those portions of said substrate coated with said carbonaceous coating from an electrolytic metal plating solution.
Dependencies are inferred from the claim text.