Infrared transparent soldering tool and infrared soldering method

Abstract

A soldering tool that comprises a selected salt, including Group I and II halides such as potassium chloride, for example, that is transparent to infrared energy. A selected salt is formed into a tool having a specific shape for placement during soldering. The tool is used to position and hold component leads during infrared soldering. The tool is formed into a shape that matches the shape of a component and whose leads are to be soldered. The tool is configured so that it may be disposed over the component so that the tool contacts the leads and causes them to contact pads to which the leads. The tool is reusable in that after showing signs of wear, it may be recycled, reformed, and reused. An infrared soldering method for soldering leads to pads comprises the following steps. The tool is fabricated from a material that is transparent to infrared radiation. The tool formed into a shape that matches the shape of the component and contacts the leads to cause them to contact the pads. The tool is placed over the component so that the tool holds the leads in place. Pressure is applied to the tool to provide force to hold the leads in place on the pads. The component 12 and the tool are then disposed in an inert atmosphere in a infrared reflow soldering machine. The leads are infrared soldered to the pads using the infrared reflow soldering machine.

Dependencies are inferred from the claim text.