Method for fastening a first substrate on a second substrate and employment of said method for manufacturing a three-dimensional circuit arrangement
AssigneeSiemens Aktiengesellschaft
InventorsWerner Pamler, Siegfried Schwarzl
Life of this patent
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Abstract
For fastening a first substrate (11) on a second substrate (21), gallium is selectively deposited on the surface of electrically conductive structures (18) located on the first substrate (11), being deposited in a CVD process upon employment of a metalloorganic compound. After the joining of the substrates (11, 21), the gallium (19) is mixed with a metal (28) that forms a refractory intermetallic phase with gallium, this forming a firm connection between the substrates. The method can be especially utilized for cubic integration.
Claims20
A method for electrically connecting and mechanically securing a first substrate to a second substrate, said method comprising the steps of:
- providing a first substrate including at least one surface having electrically conductive structures and insulating structures defined thereon;
- selectively depositing a gallium layer onto surfaces of the electrically conductive structures by vapor phase deposition using a metalloorganic compound;
- providing a second substrate including at least one surface having electrically conductive structures and insulating structures defined thereon;
- moving the first and the second substrates relative to each other so that at least portions of their respective electrically conductive structures are disposed in abutting face to face relationship to provide an assembly;
- and
- thereafter, subjecting the assembly to conditions sufficient to cause the gallium layer to melt and to form an intermetallic phase with the electrically conductive regions on the first and second substrates to electrically connect and mechanically secure the first and second substrates together.
Dependencies are inferred from the claim text.