Mounting apparatus of solder-balls
AssigneeSony Corporation
InventorYasuo Kawada
Life of this patent
Estimating the term…
Abstract
A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.
Claims19
An apparatus for mounting solder-balls on a plurality of pad electrodes formed on a circuit substrate, comprising:
- a ball suction jig having a plurality of ball suction holes formed in a jig body in correspondence with an electrode pattern of the substrate and a hollow space formed in an interior of the jig body in communication with each of the ball suction holes;
- a ball feed jig having a ball tank receiving the solder-balls for feeding the solder-balls to said ball suction jig through an opening portion of said ball tank;
- and
- a blow means for agitating the solder-balls received in said ball tank, said blow means comprising blow out holes arranged through a bottom wall of said ball tank and connectable to a supply of pressurized gas, and said bottom wall comprises annular concave ball receivers surrounding said blow out holes.
An apparatus for mounting solder-balls on a plurality of pad electrodes formed on a circuit substrate, comprising:
- a ball suction jig having a plurality of ball suction holes formed in a jig body in correspondence with an electrode pattern of the substrate and a hollow space formed in an interior of the jig body in communication with each of the ball suction holes;
- a ball feed jig having a ball tank receiving the solder-balls for feeding the solder-balls to said ball suction jig through an opening portion of said ball tank;
- a blow means for agitating the solder-balls received in said ball tank;
- a plurality of ball pusher pins slidably inserted into the ball suction holes in said ball feed jig;
- a pin block movably disposed within the hollow space in said ball suction jig for supporting said plurality of ball pushers;
- and
- a pin drive section for sliding said ball pusher pins in an axial direction of the suction holes.
An apparatus for mounting solder-balls on a plurality of pad electrodes formed on a circuit substrate, comprising:
- a ball suction jig having a plurality of ball suction holes formed in a jig body in correspondence with an electrode pattern of the substrate and a hollow space formed in an interior of the jig body in communication with each of the ball suction holes;
- a ball feed jig having a ball tank receiving the solder-balls for feeding the solder-balls to said ball suction jig through an opening portion of said ball tank, wherein said opening portion comprises a guide mask having a plurality of ball through-holes formed in correspondence with an arrangement pattern of the ball suction holes and arranged adjacent said ball suction jig;
- and
- a blow means for agitating the solder-balls received in said ball tank.
Dependencies are inferred from the claim text.