Linkage drive mechanism for ultrasonic wirebonding
AssigneeInternational Business Machines Corporation
InventorsJiann-Chang Lo, Michael Servedio
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsJiann-Chang Lo, Michael Servedio
Estimating the term…
An ultrasonic wirebonding assembly, consisting of an actuator producing vibrations at an ultrasonic frequency and a tip transmitting such vibrations to a bonding wire atop a terminal to which the wire is to be bonded, is moved among positions on a circuit chip where wirebonding operations are to occur by means of a linkage. The linkage consists of first and second drive arms, each of which is pivoted on a single stationary shaft, a drive link pivoted on the second drive arm, and a connecting link extending between the drive link and the first drive arm, being pivoted at each end. Each arm is independently driven using a motor having a coil moving over an arcuate permanent magnet. The wirebonding assembly is driven vertically, downward in a direction of engagement with the workpiece and upward in a direction of disengagement with the workpiece, on the drive link by means of a linear motor. The rapid movements available from this linkage facilitate the use of an incrementally moving conveyer holding a number of circuit chips on which wirebonding operations are to be performed.
Apparatus for performing wirebonding operations on circuit chips, wherein said apparatus comprises:
Dependencies are inferred from the claim text.