Method of manufacturing a multilayer electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKenji Kubota, Norio Sakai, Shoichi Kawabata
Life of this patent
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Abstract
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.
Claims7
A method of manufacturing a plurality of multilayer electronic components, comprising the steps of:
- preparing a mother laminate, adapted to be cut along prescribed cutting lines for obtaining said plurality of multilayer electronic components;
- said mother laminate being formed by the steps of stacking a plurality of mother insulating sheets with internal circuit elements interposed between said mother insulating sheets;
- said internal circuit elements providing respective said multilayer electronic components by said internal circuit elements being distributed in respective regions of said mother laminate to be parted by said prescribed cutting lines;
- and
- forming via holes in said mother laminate, and providing said holes with conductive materials electrically connected with said internal circuit elements, in positions in said mother laminate so as to be exposed at cut surfaces to be formed by cutting along said prescribed cutting lines;
- and
- cutting partially but not completely through said mother laminate along said prescribed cutting lines so as to expose said conductive materials at said cut surfaces and thereby form said plurality of multilayer electronic components, which are electrically independent of each other while still being mechanically integrated with each other.
Dependencies are inferred from the claim text.