Silicon based sensor apparatus
AssigneeTexas Instruments Incorporated
InventorsMark Appleton, William R. Krenik
Life of this patent
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Abstract
A biomedical sensor (20) is formed on a semiconductor substrate (22). Insulated dielectric layers (23, 24) are formed on the face and backside of the semiconductor substrate (22). Metal leads (26, 28) contact the substrate (22) through openings in the dielectric layer (23). The leads (26, 28) are also each connected to a set of interleaved longitudinal contact fingers (27, 29). A pair of contacts (30, 32) are formed on the opposite side of the substrate (22) from the contact figures (27, 29). A conductive biologic sample is placed over the interleaf fingers (27, 29), electrical measurements can be made through backside contacts (30, 32) so resistance measurements can be taken.
Claims11
A biosensor, comprising:
- a semiconductor substrate having a first side and a second side;
- a first contact region on the first side of the substrate to directly connect to the biosensor;
- a second contact region on the second side of the substrate;
- and
- conductive region extending from the contact region on the first side to the second contact region on the second side.
A biosensor on a semiconductor substrate, comprising:
- a first and second contact region formed on a first side of the substrate to directly connect to the biosensor;
- a first and second contact region formed on a second side of the substrate;
- and
- a pair of conductive regions extending through the substrate, each providing an ohmic connection between the one of the contact regions on the first side and one of the contact regions on the second side.
A biosensing system formed on a semiconductor substrate, comprising:
- a plurality of pairs of contacts on a first side of the substrate to directly to the biosensing system;
- a plurality of pairs of contacts on a second side of the substrate, each of said pairs associated with a pair of contacts on the first side;
- a plurality of pairs of conductive regions through the substrate, each of said conductive regions making ohmic contact between one of a pair of contacts on the first side and one of the pair of contacts on the second side of the substrate;
- an analysis circuit on the backside of the substrate for performing electrical measurements between the contacts on the second side of the wafer;
- and
- a circuit for selectively connecting one of the pairs of contacts on the second side of the substrate to the analysis circuit.
Dependencies are inferred from the claim text.