US 5,621,837 AGranted

Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit and process for fabricating platform

AssigneeNippon Telegraph and Telephone Corporation

InventorsYasufumi Yamada, Shinji Mino, Ikuo Ogawa, Hiroshi Terui, Kaoru Yoshino, Kuniharu Kato, Kazuyuki Moriwaki, Akio Sugita, Masahiro Yanagisawa, Toshikazu Hashimoto

Life of this patent

Estimating the term…

patentgrep

Loading patent…

Abstract

An opto-electronic hybrid integrated circuit of the present invention satisfy a low-loss optical waveguide function, an optical bench function and a high-frequency electrical wiring function. The circuit includes a substrate such as a silicon substrate, a dielectric optical waveguide part arranged in a recess of the substrate, and an optical device mounting part formed on a protrusion of the substrate. An electrical wiring part is disposed on the dielectric layer. The optical device is mounted on the substrate. An optical sub-module includes the optical device which is possible to mount on the substrate.

Claims3

Dependent claims

An optical sub-module, comprising:

an optical functional device having an active layer and an optical device height reference surface separated from said active layer by a predetermined distance;
a carrier having an optical device holding surface for holding said optical functional device, a carrier height reference surface separated from said optical device holding surface by a predetermined distance, and a carrier electrical wiring, wherein said carrier is formed of a substrate having a protrusion and a recess, wherein said optical device holding surface and said carrier height reference surface are formed of said substrate protrusion, and wherein said carrier electrical wiring is formed within said substrate recess;
said optical device height reference surface of said optical functional device being fixedly contacted with the optical device holding surface of said carrier, and an active-layer-side electrode of said optical functional device being electrically connected to said carrier electrical wiring.

Dependencies are inferred from the claim text.

Facts

Application: 08/286,968Filed 8 Aug 1994
Priority: JP 5-1973259 Aug 1993
Granted: 15 Apr 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

G02B 6/4232
Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements: using the surface tension of fluid solder…
G02B 6/42
Coupling light guides: coupling light guides with opto-electronic elements
G02B 6/4224
Involving a visual detection of the position of the elements, e.g. by using a microscope or a camera: using visual alignment markings, e.g. index…
G02B 6/4227
Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements: active alignment methods,…