Directional spray pad scrubber

In chemical-mechanical planarization of semiconductor wafers, a method for cleaning a planarizing surface of a polishing pad, comprising the steps of:

• moving the polishing pad;
• impinging the planarizing surface with a first fluid stream directed toward a peripheral edge of the pad;
• and
• impinging the planarizing surface with a second fluid stream directed toward the peripheral edge of the pad and toward the first fluid stream so that the first and second fluid streams converge and form a combined stream that flows outwardly toward the peripheral edge of the pad.

A pad scrubber for cleaning a planarizing surface of a polishing pad used for chemical-mechanical processing of semiconductor wafers, the pad scrubber comprising:

• a fluid manifold;
• a first nozzle attached to the manifold for directing a first fluid stream generally outwardly toward a peripheral edge of the pad;
• and
• a second nozzle attached to the manifold for directing a second fluid stream, the second spray nozzle being canted to direct the second fluid stream generally outwardly toward the peripheral edge of the pad and toward the first fluid stream.