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US 5,614,043 AGranted
Method for fabricating electronic components incorporating ceramic-metal composites
AssigneeCoors Ceramics Company
InventorsMarcus A. Ritland, Dennis W. Readey, Jack D. Sibold, James E. Stephan
Life of this patent
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Abstract
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.
Claims10
A method for making a substrate for electronic components, comprising the steps of:
- (a) forming a substantially flat and thin green sheet of ceramic having an upper surface and a lower surface;
- (b) forming a plurality of vias in said upper surface of said green ceramic sheet and extending through said green ceramic sheet;
- (c) filling at least a portion of said vias with a ceramic slurry capable of forming a porous sintered ceramic having a porosity of at least about 5 volume percent after sintering;
- (d) sintering said sheet of ceramic to form a sintered sheet having a plurality of vias comprising porous ceramic having an open porosity of at least about 5 volume percent;
- (e) contacting said ceramic sheet with a molten metal under conditions such that said molten metal infiltrates said porous ceramic vias and substantially fills said porous ceramic vias;
- and
- (f) cooling said metal infiltrated ceramic to form a ceramic sheet having ceramic-metal composite vias.
4 more elements
A method for making a multi-layer ceramic device for electronic components, comprising the steps of:
- (a) forming a plurality of substantially flat and thin green sheets of ceramic, each of said green sheets having an upper surface and a lower surface;
- (b) forming a plurality of vias in at least one of said green sheets of ceramic;
- (c) filling at least a portion of said vias with a ceramic slurry capable of forming a porous sintered ceramic having a porosity of at least about 5 volume percent after sintering;
- (d) applying a ceramic slurry capable of forming a porous sintered ceramic having a porosity of at least about 5 volume percent after sintering to at least a portion of said upper surface of at least one of said green sheets of ceramic to form a porous conductor path;
- (e) stacking and laminating said sheets of ceramic to form a multi-layer ceramic device;
- (f) sintering said multi-layer ceramic device to form a sintered multi-layer ceramic device;
- (g) contacting said sintered multi-layer device with a molten metal under conditions such that said molten metal infiltrates said porous vias and said porous conductive path portions to form a plurality of conductive vias and conductive paths within said multi-layer ceramic device;
- and
- (h) cooling said metal infiltrated multi-layered ceramic device.
6 more elements
Dependencies are inferred from the claim text.