Method for forming thermal-ink heater array using rectifying material
AssigneeHewlett-Packard Company
InventorDavid E. Hackleman
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Company
InventorDavid E. Hackleman
Estimating the term…
A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A first material layer is deposited atop the insulating substrate and patterned in parallel stripes. A first insulating layer is deposited atop the first material layer and patterned with contact windows above the first material layer in corresponding desired heating locations, usually in a symmetrical grid. A second material layer is deposited atop the first insulating layer and pattern in parallel stripes orthogonal to those in the first material layer. The first and second material layers are in physical and electrical contact with each other through the contact windows in the first insulating layer to form a resistive diode junction at each desired heating location. The entire surface of the heating array is covered with a second insulating layer, with contacts provided to the first and second material layers.
A fabrication method for a heater array in an ink jet printer, the method comprising the steps of:
A method for fabricating a heater array in an ink jet printhead, comprising:
Dependencies are inferred from the claim text.