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US 5,609,517 AGranted
Composite polishing pad
AssigneeInternational Business Machines Corporation
InventorMichael F. Lofaro
Life of this patent
Estimating the term…
Abstract
A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.
Claims13
A composite polishing pad for polishing semiconductor wafers, comprising:
- a supporting layer of a first hardness type, the supporting layer having an upper and a lower surface;
- a plurality of nodes of a second hardness type attached to the upper surface of the supporting layer;
- an upper layer of a third hardness type attached to the upper surface of the supporting layer, the upper layer surrounding but not covering the plurality of nodes, and the upper layer having a height greater than the nodes.
A composite polishing pad for polishing semiconductor wafers, comprising:
- a translucent supporting layer of a first hardness type, the supporting layer having an upper and a lower surface;
- a plurality of translucent nodes of a second hardness type attached to the upper surface of the supporting layer;
- an upper layer of a third hardness type substantially less hard than the first and second hardness types, the upper layer attached to the upper surface of the supporting layer, and the upper layer surrounding but not covering the plurality of nodes.
Dependencies are inferred from the claim text.