Conductive metal ball attaching apparatus and method, and bump forming method

A conductive metal ball attaching method comprising:

• a first step of vacuum-absorbing conductive metal balls to respective absorber holes formed at a lower side of a pickup head for picking them up;
• a second step of detecting whether the conductive metal balls are vacuum-absorbed to all of said absorber holes;
• a third step of applying a bonding material to a lower side of each of the conductive metal balls vacuum-absorbed to said absorber holes;
• a fourth step of detecting presence or absence of the conductive metal ball dislodged from said pickup head during said third step;
• a fifth step of attaching the conductive metal balls onto electrodes of a workpiece, said conductive metal balls absorbed to the absorber holes of said pickup head and applied with the bonding material;
• and
• a sixth step of detecting an attaching error whether all the conductive metal balls absorbed to the absorber holes of said pickup head are attached onto said workpiece.

A bump forming method for attaching solder balls onto electrodes of a workpiece to form bumps, said method comprising:

• a first step of vacuum-absorbing the solder balls to respective absorber holes formed at a lower side of a pickup head for picking them up;
• a second step of detecting whether the solder balls are vacuum-absorbed to all of said absorber holes;
• a third step of fluxing a lower side of each of the solder balls vacuum-absorbed to said absorber holes:
• a fourth step of detecting presence or absence of the solder ball dislodged from said pickup head during said third step;
• a fifth step of attaching the solder balls onto the electrodes of the workpiece, said solder balls absorbed to the absorber holes of said pickup head and fluxed:
• a sixth step of detecting an attaching error whether all the solder balls absorbed to the absorber holes of said pickup head are attached onto said workpiece:
• and
• a seventh step of heating said workpiece to melt the solder balls attached to the electrodes of said workpiece.

A bump forming method for attaching conductive metal balls onto electrodes of a workpiece to form bumps, said method comprising:

• a first step of vacuum-absorbing the conductive metal balls to respective absorber holes formed at a lower side of a pickup head for picking them up;
• a second step of detecting whether the conductive metal balls are vacuum-absorbed to all of said absorber holes;
• a third step of applying an adhesive to a lower side of each of the conductive metal balls vacuum-absorbed to said absorber holes;
• a fourth step of detecting presence or absence of the conductive metal ball dislodged from said pickup head during said third step;
• a fifth step of attaching the conductive metal balls onto the electrodes of the workpiece, said conductive metal balls absorbed to the absorber holes of said pickup head and applied with the bond;
• a sixth step of detecting an attaching error whether all the conductive metal balls absorbed to the absorber holes of said pickup head are attached onto said workpiece;
• and
• a seventh step of heating said workpiece to harden said adhesive applied to the conductive metal balls.