US 5,590,389 A · Sputtering target with ultra-fine, oriented grains and method of making same

Abstract

A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.

Claims18

Dependent claims

A method of making a sputtering target comprising:

extruding a metal workpiece comprising a metal from the group consisting of aluminum, copper, and titanium, alone or alloyed with a dissimilar metal selected from the group consisting of copper, silicon, zirconium, titanium, tungsten, platinum, gold, niobium, rhenium, scandium, cobalt, molybdenum, hafnium, and alloys thereof, through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, whereby the workpiece enters the inlet channel and exits the outlet channel, to produce an extrusion in which the grains of the major constituent measure less than about 20 microns for an aluminum body, less than 30 microns for a copper body, and less than 10 microns for a titanium body;
and
fabricating the extrusion into a sputtering target.

Dependencies are inferred from the claim text.

Sputtering target with ultra-fine, oriented grains and method of making same

Life of this patent

Sputtering target with ultra-fine, oriented grains and method of making same

Life of this patent

Abstract

Claims18