Edge die bond semiconductor package

An edge die bond semiconductor package comprising:

• a semiconductor die having an active major surface and a mounting edge substantially orthogonal to the active surface, the semiconductor die including a sensor diaphragm positioned in the major surface and a grid surrounding the diaphragm and defining a depression in the semiconductor die;
• a constraint die having a cooperating surface formed to mate with the grid of the semiconductor die and a mounting edge substantially orthogonal to the cooperating surface, the semiconductor die and the constraint die being formed of materials having substantially similar temperature coefficients of expansion;
• the semiconductor die and the constraint die being chemically bonded together so that a sensor cavity is defined between the diaphragm and the constraint die with the diaphragm defining one wall of the sensor cavity, the semiconductor die and the constraint die being further bonded with the mounting edge of the semiconductor die and the mounting edge of the constraint die forming a single mounting edge substantially orthogonal to the diaphragm;
• a base having a mounting surface;
• and
• material affixing the single mounting edge of the semiconductor die and the constraint die to the mounting surface of the base.