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US 5,589,250 AGranted
Resin compositions and printed circuit boards using the same
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Ritsuko Kato
Life of this patent
Estimating the term…
Abstract
A resin composition as well as a printed circuit board using the same are disclosed. The resin composition is formed by dispersing powder of a cured heat-resistant resin powder soluble in acid or oxidizing agent into a matrix of an uncured photosensitive resin hardly soluble in acid or oxidizing agent, in which a coloring matter is added to the resin matrix and/or the heat-resistant resin powder.
Claims9
A multilayer printed circuit board comprising:
- a substrate;
- a first conductor circuit formed on the substrate;
- an adhesive layer formed on the conductor circuit by dispersing 5-350 parts by weight of particles of a cured heat-resistant resin soluble in an acid or an oxidizing agent into 100 parts by weight of a matrix of an uncured photosensitive resin hardly soluble in the acid or oxidizing agent;
- a second conductor circuit formed on the adhesive layer and electrically connected to the first conductor circuit through a via-hole;
- wherein the particles of the cured heat-resistant resin include 0.10-1.50% by weight of coloring matter selected from the group consisting of phthalocyanine, phthalocyanine derivatives and cyanine color.
2 more elements
Dependencies are inferred from the claim text.