Polymerizable, curable molding composition and a molding or coating process using this molding composition

A polymerizable curable composition, comprising:

• (A) 100 parts by weight of an unsaturated epoxyester resin with an acid value below 3.0, (B) 10 to 40 parts by weight of a polymerizable monomer selected from the group consisting of phenoxyethyl acrylate, 2-acroyloxyethyl-2-hydroxypropyl phthalate and mixtures thereof and (C) 1 to 5 parts by weight of a mixture of hydroxyketone oligomer and 2-hydroxy-2-methyl-1-phenylpropan-1-one wherein said unsaturated epoxyester resin is derived from a mixture of unsaturated carboxylic acid, saturated carboxylic acid and epoxy compound.

A polymerizable curable composition, comprising:

• (A) 100 parts by weight of an unsaturated epoxyester resin with an acid value below 3.0, (B) 10 to 40 parts by weight of a polymerizable monomer selected from the group consisting of phenoxyethyl acrylate, 2-acroyloxyethyl-2-hydroxypropyl phthalate and mixtures thereof and (C) 1 to 5 parts by weight of a mixture of hydroxyketone oligomer and 2-hydroxy-2-methyl-1-phenylpropan-1-one wherein said unsaturated epoxyester resin is derived from an epoxy compound selected from the group consisting of reaction products of epichlorohydrin with one or more of bisphenol A, glycols, carboxylic acids, phenol/formaldehyde condensates and oxidation products of unsaturated compounds.