Semiconductor integrated circuit device having improvement arrangement of pads

The semiconductor integrated circuit device, comprising:

• a package;
• a semiconductor chip housed in said package and selectively carrying out any of a plurality of first predetermined operations and any of a plurality of second predetermined operations;
• a plurality of leads each disposed from the outside of said package to a periphery of said semiconductor chip;
• a plurality of first selection pads each disposed corresponding to any of said plurality of leads on said semiconductor chip and having one of a connection state to a corresponding lead and a disconnection state therefrom;
• first selecting means responsive to the operation selected by said plurality of first selection pads for selecting any of said plurality of first predetermined operations;
• a plurality of second selection pads, each disposed corresponding to any of said plurality of leads on said semiconductor chip and having one of a connection state to a corresponding lead and a disconnection state therefrom;
• and
• second selecting means responsive to the operation selected by said first selecting means and said connection/disconnection states of said plurality of second selection pads for selecting any of said plurality of second predetermined operations.

A semiconductor integrated circuit device for use as a normal bend product and a reverse bend product, comprising:

• a package;
• a semiconductor chip housed in said package;
• a plurality of leads disposed along two opposing sides of said package, one half of all leads disposed on one of said two opposing sides and another half of all leads disposed on another of said two opposing sides to form pairs of opposing leads, and each lead disposed from the outside of said package to a periphery of said semiconductor chip;
• and
• a plurality of pads corresponding in number to said plurality of leads disposed in parallel with said two opposing sides on said semiconductor chip, a pair of pads corresponding to a pair of opposing leads, said pair of pads being disposed adjacent to each other, wherein
• when the product is configured as a normal bend product, one of two pads corresponding to two leads opposing each other is connected to one of said two leads and the other of the two pads is connected to the other of said two leads, and
• when the product is configured as a reverse bend product, said one of two pads is connected to said other of said two leads, and said other of the two pads is connected to said one of said two leads.