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AssigneeNippondenso Co., Ltd.
InventorsYasunobu Hirao, Yuji Motoyama, Takashi Nagasaka, Hidekazu Katsuyama
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In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
A method for producing an electronic device having circuit boards which mount electronic circuits thereon and which are arranged in a multi-board structure within a casing, said method comprising the steps of:
A method for producing an electronic device having circuit boards which mount electronic circuits thereon and which are arranged in a multi-board structure within a casing having, at a side surface thereof, a capacitor box, said method comprising the steps of:
Dependencies are inferred from the claim text.