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US 5,586,004 AGranted
Mounting assembly for power semiconductors
AssigneeWavedriver Limited
InventorsRoss M. Green, Michael J. Kellaway, David J. Shemmans, David J. McShane
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Abstract
A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201,203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).
Claims15
A mounting assembly for power semiconductors, the assembly comprising:
- a plurality of plate-like modules arranged around a central axis, each module comprising;
- at least two walls, at least one of said walls defining a flat major surface providing a heat sink for the direct mounting of semiconductor components thereon;
- and
- an internal passage defined between said walls for the passage of a fluid cooling medium therethrough in order to cool semiconductor components mounted on said surface.
1 more element
Dependencies are inferred from the claim text.