Waterproof connection method for covered wire with resin encapsulation

Abstract

In the covered-wire connection method and structure in which at least one of members to be conductively connected to each other is a covered wire comprising a conductive wire portion and a cover portion of resin which is coated around the outer periphery of the conductive wire portion, both of the members are overlapped with each other at connection portions thereof, the overlapped connection portions are pinched between a pair of resin chips, and then the cover portion are melted and dispersed by ultrasonic vibration while pressing the connection portions of the members from the outside of the resin chips to conductively connect both of the members to each other at the connection portions thereof. Thereafter, the pair of the resin chips are melted to be fixed to each other, so that the connection portions are sealed with the melted resin chips.

Dependencies are inferred from the claim text.