Pad array semiconductor device having a heat sink with die receiving cavity

A semiconductor device comprising:

• a circuitized substrate having a top surface, a bottom surface, a plurality of conductive traces formed on the top surface, an opening which extends completely through the substrate, and a recess in the top surface adjacent the opening;
• a heat sink comprising a die receiving cavity, a base portion, sidewalls, and flanges extending from the sidewalls, the heat sink being inserted into the opening of the substrate such that the opening is at least partially enclosed, such that the sidewalls are adjacent the substrate within the opening, and such that the flanges fit in the recess and are planar with the top surface of the substrate and mechanically support the heat sink within the opening;
• a semiconductor die positioned in the die receiving cavity of the heat sink and attached to the base portion thereof;
• means for electrically coupling the semiconductor die to the plurality of conductive traces;
• means for encapsulating the semiconductor die and the opening of the substrate;
• and
• terminals attached to the bottom surface of the substrate and electrically coupled to the plurality of conductive traces for electrically coupling the device to a user substrate.

A semiconductor device comprising:

• a circuitized substrate having a top surface, a bottom surface, a plurality of conductive traces formed on the top surface, an opening which extends completely through the substrate, and a recess in the bottom surface adjacent the opening;
• a heat sink comprising a die receiving cavity, a base portion, sidewalls, and flanges extending from the sidewalls, the heat sink being inserted into the opening of the substrate such that the opening is at least partially enclosed, such that the sidewalls are adjacent-the substrate within the opening, and such that the flanges fit in the recess and are planar with the bottom surface of the substrate and mechanically support the heat sink within the opening;
• a semiconductor die positioned in the die receiving cavity of the heat sink and attached to the base portion thereof;
• means for electrically coupling the semiconductor die to the plurality of conductive traces;
• means for encapsulating the semiconductor die and the opening of the substrate;
• and
• terminals attached to the bottom surface of the substrate and electrically coupled to the plurality of conductive traces for electrically coupling the device to a user substrate.