Sheet-framed IC carrier, method for producing the same, and IC carrier case

A sheet-framed IC carrier comprising:

• a sheet frame having an aperture having a first area;
• a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer;
• and
• an IC carrier having a base and an IC module mounted on the base, said base having the same shape as said aperture and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame and being secured there with said adhesive layer of said backing film,
• wherein the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier,
• wherein said backing film covers the entirety of said peripheral slit on said back surface of said sheet frame, and
• wherein the IC carrier has a main portion and an end portion and wherein only said main portion is adhered to the backing film,
• whereby said IC carrier can be easily peeled away from said adhesive layer of said backing film.