Method for burn-in of high power semiconductor devices
AssigneeMicro Control Company
InventorsHarold E. Hamilton, Brian R. Bloch, James R. Zimmer
Life of this patent
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Abstract
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.
Claims6
A method for controlling the temperature of semiconductor devices in a burn-in chamber during burn-in, the method comprising the steps of:
- providing a liquid reservoir containing a liquid;
- providing a plurality of spray nozzle arrays;
- providing delivery means for delivering the liquid from the liquid reservoir to the spray nozzle arrays;
- providing temperature control means comprising:
- a heating element and a cooling element attached to the liquid reservoir;
- and
- a plurality of pipe heating elements attached to the delivery means, the pipe heating elements being capable of individually altering the temperature of the liquid provided to each semiconductor device;
- thermally conditioning the liquid to a desired temperature through the operation of the temperature control means;
- and
- forcing the liquid from the liquid reservoir to the spray nozzle arrays so that the liquid is sprayed on the semiconductor devices.
Dependencies are inferred from the claim text.