Microelectronic integrated circuit structure and method using three directional interconnect routing based on hexagonal geometry

Abstract

Electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit extend in three directions that are angularly displaced from each other by 60.degree.. The conductors pass through points defined by centers of closely packed hexagons superimposed on the circuit such that the conductors extend perpendicular to edges of the hexagons. The conductors that extend in the three directions can be formed in three different layers, or alternatively the conductors that extend in two or three of the directions can be formed in a single layer as long as they do not cross. The conductors can be formed in layers that are electrically insulated from the cells and extend over the cells, or can extend through hexagons between cells. Cells are defined by clusters of two or more hexagons, enabling a variety of cell shapes to be accommodated. Cells have serrated edges defined by edges of hexagons such that adjacent cells fit together exactly, providing a closely packed arrangement of cells on the substrate with 100% utilization of space and 100% equidistant connectivity. Sets of cells having the same functionality and different shapes are provided.

Dependencies are inferred from the claim text.