Apparatus for measuring a cutting blade width in a cutting apparatus
AssigneeShima Seiki Manufacturing, Ltd.
InventorsToshiaki Morita, Toshiro Ochi
Life of this patent
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AssigneeShima Seiki Manufacturing, Ltd.
InventorsToshiaki Morita, Toshiro Ochi
Estimating the term…
An apparatus for measuring the width of a cutting blade in a linear motor is activated when the cutting blade is raised. A working pin is advanced and one end of a detecting pin is abutted against an edge of the cutting blade. Thereafter, the working pin is returned. The blade width is derived by deducting the number of inputted driving pulses in returning from the advanced position of the detecting pin. The cutting blade is polished each polishing cycle for predetermined times by polishing rollers. The width of the cutting blade is measured by blade width detecting means during each predetermined polishing cycle. The measurement value of the blade width is fed back into a control device so that the subsequent polishing time of the cutting blade with the polishing rollers is adjusted until it becomes appropriate. The expiration of the useful life of the polishing rollers is determined when a long polishing time is required.
An apparatus for measuring a cutting blade width comprising:
A cutting apparatus comprising:
A cutting apparatus comprising:
Dependencies are inferred from the claim text.