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US 5,572,065 AGranted
Hermetically sealed ceramic integrated circuit heat dissipating package
AssigneeStaktek Corporation
InventorCarmen D. Burns
Life of this patent
Estimating the term…
Abstract
A method and apparatus for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.
Claims63
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising three thin layers, including a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing,
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- and
- said lead frame conductors are connected to said housing wire bond pads.
6 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprised of three thin layers:
- a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- wherein said lead frame conductors are connected to said housing wire bond pads;
- and
- wherein the ceramic housing seal ring layer is at least 7 mils thick.
8 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- wherein said lead frame conductors are connected to said housing wire bond pads;
- said package further comprising an adhesive layer comprised of silver loaded glass disposed between said integrated circuit chip and said ceramic housing.
6 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- wherein said lead frame conductors are connected to said housing wire bond pads;
- and
- wherein said integrated circuit chip connection pads and said housing wire bond pads are connected together by aluminum bonding wires.
7 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- and
- said lead frame conductors are connected to said housing wire bond pads;
- wherein said housing seal ring is comprised of a solder ring.
7 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- said lead frame conductors are connected to said housing wire bond pads;
- and
- a thin insulating layer over said cover and hermetic seal.
7 more elements
A hermetically sealed ceramic integrated circuit package having a standard size and housing various sizes of integrated circuit chip dies with connections thereto made by means of a first lead frame laminated onto the face of the chip, the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a first lead frame laminated thereto, said first lead frame having a plurality of conductors connected to connection pads of said integrated circuit chip;
- a ceramic housing comprising a base, bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing;
- said first lead frame conductors connected to said housing bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a second lead frame having a plurality of electrical conductors;
- said second lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads;
- and
- said second lead frame conductors are connected to said housing bond pads.
6 more elements
A hermetically sealed ceramic integrated circuit package having good thermal, conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- and
- said lead frame conductors are connected to said housing wire bond pads;
- wherein said integrated circuit chip and ceramic housing are attached together by laminating a thermally filled polymer therebetween.
7 more elements
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed;
- a metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said ground plane laminated to said first layer of adhesive;
- a second layer of adhesive on said ground plane wherein the circuit connection pads are exposed;
- a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto;
- a ceramic housing comprising a base, bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame is accessible from within said ceramic housing;
- said lead frame conductors and said metal ground plane connected to said housing bond pads;
- and
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
7 more elements
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed;
- a lead frame having a plurality of electrical conductors, said lead frame laminated to said first layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto;
- a second layer of adhesive on said lead frame;
- a metal ground plane, said ground plane laminated to said second layer of adhesive;
- a ceramic housing comprising a base, bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground plane are accessible from within said ceramic housing;
- said lead frame conductors and said metal ground plane connected to said housing bond pads;
- and
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
7 more elements
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed;
- a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive;
- a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed;
- a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto;
- a third layer of adhesive on said lead frame;
- a second metal ground plane, said ground plane laminated to said third layer of adhesive;
- a ceramic housing comprising a base, bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground planes are accessible from within said ceramic housing;
- said lead frame conductors and said first and second metal ground planes connected to said housing bond pads;
- and
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
9 more elements
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed;
- a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive;
- a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed;
- a first lead frame having a plurality of electrical conductors, said first lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto;
- a ceramic housing comprising a base, bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing;
- said first lead frame conductors and said first metal ground plane connected to said housing bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a second metal ground plane, said second metal ground plane laminated to said ceramic housing;
- a third layer of adhesive on said second ground plane;
- a second lead frame having a plurality of electrical conductors, said second lead frame attached to said third layer of adhesive, wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads;
- and
- said second lead frame conductors are connected to said housing bond pads.
11 more elements
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
- a ceramic housing comprising a base, wire bond pads and seal ring;
- said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing;
- said integrated circuit chip connection pads connected to said housing wire bond pads;
- a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together;
- a lead frame having a plurality of electrical conductors;
- said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads;
- and
- said lead frame conductors are connected to said housing wire bond pads;
- wherein connections are made by thermal compression bonding.
7 more elements
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising:
- an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides;
- a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element;
- wherein
- said first lead frame is affixed in heat exchange relationship to said upper or lower major surface of said integrated circuit package and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors;
- and
- wherein said lead frame is affixed to said upper or lower major surface of said integrated circuit package with thermally conductive adhesive.
3 more elements
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising:
- an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides;
- a first heat spreader affixed in heat exchange relationship to the upper major surface of said integrated circuit package;
- a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element;
- and wherein
- said first lead frame is affixed in heat exchange relationship to said first heat spreader and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors.
2 more elements
Dependencies are inferred from the claim text.