Reference wire compensation method and apparatus
AssigneeUltrasonic Arrays, Inc.
InventorsMartin J. Kenney, John K. Billings
Life of this patent
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AssigneeUltrasonic Arrays, Inc.
InventorsMartin J. Kenney, John K. Billings
Estimating the term…
A scanning system for monitoring the thickness, profile or other data from a moving product which includes a frame for mounting scanning transducers. The product is carried on a conveyor or the like through the frame and the transducers are mounted for transverse scanning motion across the top and bottom surfaces of the product at right angles to its direction of travel. Reference wires are connected between the side members of the frame and maintained at a constant tension independent of ambient temperatures. Reference wires are located between the transducers and both the top and bottom surfaces of the product. The wires provide a constant reference to detect distortion of the frame due to thermal or other stress and to provide correction data which is used to compensate for frame irregularities.
In combination with a frame for mounting sensor apparatus in fixed relation with an object to be sensed, said frame being subject to stress distortion, a constant reference comprising;
A method for compensating for sensor support frame stress distortion due to ambient stress conditions in a scanning system wherein the object being scanned by a sensor on said support frame is maintained a fixed distance from the frame, comprising the steps of;
In combination with a support frame including mounting members for mounting sensor apparatus in fixed relation with an object to be sensed, said mounting members being subject to stress distortion due to ambient conditions, a constant reference comprising;
Dependencies are inferred from the claim text.