Bonded wafer processing with metal silicidation
AssigneeHarris Corporation
InventorsJack H. Linn, Robert K. Lowry, George V. Rouse, James F. Buller
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Abstract
Low temperature silicon-on-insulator wafer bonding using a silicide bond formation reaction. Dielectric isolation with silicon dioxide, diamond, silicon-nitride, and so forth yields buried resistors under trench isolated silicon islands. Buried dielectrics can be thermally susceptible films like diamond due to the low temperature of the bonding silicidation reaction. Bonding silicides also provide thermal dissipating layer between a buried diamond layer and a handle wafer for good overall thermal conductivity. Bonding silicides also act as diffusion barriers.
Claims13
A method of fabrication of integrated circuits, comprising the steps of:
- (a) providing a device wafer with a surface silicon layer covering a dielectric layer and a handle wafer with a surface silicon layer;
- (b) depositing a refractory metal layer on one of said silicon surface layers and joining the device wafer surface silicon layer to the handle wafer surface silicon layer with the refractory metal layer therebetween;
- (c) heating said wafers wherein said waters bond together through formation of silicide-silicon bonds to both surface silicon layers;
- (d) thinning said device wafer;
- (e) forming trenches in said device wafer and extending through said device wafer to said dielectrically-coated layer;
- (f) forming devices in the portions of said device wafer among said trenches.
A method of wafer bonding to a produce silicon-on-insulator structure;
- comprising the steps of:
- (a) providing a device wafer and a handle wafer wherein said device wafer includes a silicon layer over a diamond layer;
- (b) joining the silicon layer covering the diamond layer of said device wafer to a surface of said handle water with silicide precursors therebetween;
- and
- (c) heating said wafers wherein said wafers bond together through silicide-silicon bond formation on both wafers.
Dependencies are inferred from the claim text.