# US 5,565,280 A · Electrical interconnect using particle enhanced joining of metal surfaces

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- Number: US 5,565,280 A
- Document ID: US5565280A
- Status: Granted
- Kind: A
- Application number: 08/422,447
- Filed: 1995-04-12
- Granted: 1996-10-15
- Earliest claimed: 1990-02-14
- Assignees: Particle Interconnect, Inc.
- Inventors: Louis Difrancesco
- Web page: https://patentgrep.com/patent/US5565280A

## CPC

- B23K 35/02: characterised by mechanical features, e.g. shape
- B23K 20/16: with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
- H05K 3/325: by abutting or pinching; Mechanical auxiliary parts therefor
- H01H 1/06: characterised by the shape or structure of the contact-making surface, e.g. grooved
- H05K 3/328: by welding
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10S 428/929: Electrical contact feature
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49126: Assembling bases
- Y10T 428/12486: Laterally noncoextensive components [e.g., embedded, etc.]
- Y10T 428/24999: Inorganic
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to whereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material, which are useful in batteries fuel cells and capacitors.

## Claims

### Claim 1

A spaced structure, comprising:
at least two parallel planar sheets; and
a particle-enhanced: material between said sheets providing a spaced separation therebetween, said particle-enhanced material including associated particles having a hardness greater than that of said parallel planar sheets;
wherein said particle-enhanced material defines a void, said void providing a fluid transport path.

### Claim 2 (depends on 1)

The structure of claim 1, wherein said fluid transport path includes a thermal transport medium.

### Claim 3

A spaced structure, comprising:
at least two parallel planar capacitor plates; and
a particle-enhanced material between said capacitor plates, said particle-enhanced material forming a dielectric matrix support providing a spaced separation therebetween, said particle-enhanced material including associated particles having a hardness greater than that of said capacitor plates.