Unit magnification projection system and method
AssigneeTamarack Scientific Co., Inc.
InventorsRonald E. Sheets, Yanrong Yuan
Life of this patent
Estimating the term…
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AssigneeTamarack Scientific Co., Inc.
InventorsRonald E. Sheets, Yanrong Yuan
Estimating the term…
A Dyson lens system includes a radiation source, a concave mirror, and a plano-convex lens. There is also incorporated in the system an additional lens that is spaced from the plano-convex lens a large part of the distance from the plano-convex lens to the mirror. A roof prism and a turning prism are provided to conduct radiation from the radiation source to the plano-convex lens and also from the plano-convex lens to an image plane. An image adjustor or compensator is provided between the prisms and either the image plane or an object plane--the latter being disposed between the radiation source and the prisms. An adjustment mechanism is provided to effect highly accurate adjustment of the location of the image, the adjustment mechanism including physical shifting to a slight degree of a portion of one or both prisms.
A Dyson lens system, which comprise:
A Dyson lens system, which comprises:
A Dyson lens system, which comprise:
A Dyson lens system, which comprises:
A Dyson lens system, which comprises:
A Dyson lens system, which comprises:
A Dyson lens system, comprising:
A Dyson lens system, comprising:
A Dyson lens system, comprising:
A Dyson lens system, comprising:
A Dyson lens system, which comprises:
A substantially one-to-one imaging method, which comprises:
A method of providing unit imaging but with controlled slight variation in magnification in order to compensate for variations in substrate sizes that occur during microelectronics manufacture, said method comprising:
A Dyson lens system, which comprise:
A Dyson lens system, which comprises:
For use in the manufacture of microelectronics components, an imaging method comprising:
A method of providing unit imaging in a Dyson system, but with controlled slight variation in magnification in order to compensate for variations in substrate sizes that occur during microelectronics manufacture, said method comprising:
A compensating Dyson lens system, comprising:
A method of achieving substantially perfect positioning of an image in the image plane of a projection scanning microlithography apparatus in which the scans are parallel to each other and partially overlap each other, so that there is no twist causing points at the image plane to be out of superposed conditions during adjacent partially-overlapping scans, which method comprises:
In combination with a projection-scanning microlithography apparatus of the type in which the scans are parallel to each other and partially overlap each other, and in which the object and image planes are parallel to each other and spaced from each other, an adjustable optical system for projecting a twist-free one-to-one image from a mask in said object plane to a substrate in said image plane with the object and image having the same orientation, said adjustable optical system comprising:
Dependencies are inferred from the claim text.