US 5,554,887 A · Plastic molded semiconductor package

Abstract

A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

Claims15

Dependent claims

A plastic molded semiconductor package comprising:

a semiconductor chip having a main surface;
a pad electrode formed on said main surface of said semiconductor chip and functioning as a part of an electrode for external connection;
an internal connection conductor formed on said pad electrode, having a substantially flat top surface and functioning as a part of said electrode for external connection;
a molding resin encapsulating said semiconductor chip and exposing only said top surface of said internal connection conductor;
and
an external connection conductor formed on said top surface of said internal connection conductor, having a substantially flat top surface and functioning as a part of said electrode for external connection.

3 more elements

Dependencies are inferred from the claim text.

Plastic molded semiconductor package

Life of this patent

Plastic molded semiconductor package

Life of this patent

Abstract

Claims15