Method of forming a primary, wet-to-wet resin bond between at least two laminates, and a product by the process thereof
AssigneeSunrez Corporation
InventorsW. Novis Smith, Mark Livesay
Life of this patent
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Abstract
The instant invention provides a method of forming a structure which includes at least two laminates each having a minor area of common overlap therebetween and a major area wherein said panels are not overlapped, which comprises the step of forming a primary, wet-to-wet resin bond between said minor areas of common overlap. The invention also contemplates at least one article of manufacture produced by the method.
Claims13
A method of forming a structure which includes at least two curable laminates or panels each having a photocurable minor area to be joined together and a cured or uncured major area, comprising the steps of:
- A. forming a primary, wet-to-wet photocurable resin bond between said minor areas;
- B. photo-shielding said minor area of each of said at least two laminates which are to be joined;
- C. curing each said major area of said at least two laminates, and then;
- D. photocuring the minor areas of overlap of uncured resin.
A method of forming a structure which includes at least two different panels in abutment, said panels at the area of abutment having a photocurable site which comprises the steps of:
- a) forming a primary wet-to-wet photocurable resin bond between the photocurable sites, and
- b) photocuring said panels at the sites to form a bond.
Dependencies are inferred from the claim text.