Chemically amplified radiation-sensitive composition
AssigneeOCG Microelectronic Materials, Inc.
InventorKenji Honda
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AssigneeOCG Microelectronic Materials, Inc.
InventorKenji Honda
Estimating the term…
A chemically amplified-type radiation-sensitive composition comprising: (a) an alkali-soluble binder resin made by a condensation reaction of: (i) hydroxystyrene moiety having formula [1] or [2]: ##STR1## wherein x is an integer from 2 to 300; with (ii) a monomethylolated phenolic compound having a formula [8]: ##STR2## wherein R.sub.1 and R.sub.2 are individually selected from the group consisting of lower alkyl group having 1-4 carbon atoms, lower alkoxy group having 1-4 carbon atoms, amino group, and carboxylic acid group; wherein R.sub.3 and R.sub.4 are individually selected from the group consisting of hydrogen, lower alkyl group having 1-4 carbon atoms, lower alkoxy groups having 1-4 carbon atoms, an amino group, and a carboxylic group; and wherein a mole ratio of the hydroxystyrene moiety to the monomethylolated phenolic compound is from about 1:10 to about 10:1; (b) at least one alkaline dissolution inhibitor containing acid-cleavable groups; and (c) at least one compound that results in generation of an acidic moiety under irradiation.
A chemically amplified radiation-sensitive composition comprising no admixture:
Dependencies are inferred from the claim text.