Method of selectively releasing plastic molding material from a surface

A method of forming a transfer molded chip carrier, comprising:

• electrically and mechanically attaching a semiconductor device to a substrate comprising a printed circuit material;
• sputter etching at least one surface of the substrate in order to increase adhesion between the substrate and a transfer molding compound subsequently attached to the substrate;
• selectively depositing a coating of a permanent ink on at least a portion of the sputter etched surface in order to reduce adhesion between the substrate surface and a transfer molding compound subsequently attached to the substrate;
• encapsulating the semiconductor device by transfer molding a plastic molding compound onto the sputter etched substrate surface and the semiconductor device, said plastic molding compound completely encapsulating the semiconductor device;
• and
• breaking away the plastic molding compound that is over the selectively coated portion of the sputter etched surface.