Low-profile ball-grid array semiconductor package

A perimeter ball-grid array (BGA) semiconductor structure comprising:

• a substrate structure having a first substrate attached to a first major surface of a base substrate, wherein the first substrate has a substantially centrally located aperture extending from a first surface to a second opposed surface to form a cavity with at least a portion of the first major surface of the base substrate providing one cavity surface, and wherein the substrate structure includes a conductive connective structure comprising a first plurality of conductive lines formed on the first surface and terminating into a first plurality of bond posts and a second plurality of conductive lines formed on the second opposed surface and terminating into a first plurality of conductive ball contacts, the first plurality of conductive lines being electrically connected to the second plurality of conductive lines;
• an integrated circuit chip having a first surface and a second opposed surface, wherein the integrated circuit chip has a plurality of conductive bond pads formed on the first surface of the integrated circuit chip, and wherein the integrated circuit chip is attached to the base substrate within the cavity, and wherein the plurality of conductive bond pads is electrically connected to the first plurality of conductive ball contacts;
• a plurality of conductive balls, each attached to one of the first plurality of conductive ball pads, wherein the base substrate provides a standoff to limit collapse of the plurality of conductive balls thereby controlling solder joint height when the substrate structure is coupled to an application substrate;
• and
• an enclosure covering at least a portion of the base substrate.